Method of vacuum injection molding for optoelectronic modules

Manufacturing optoelectronic modules includes supporting a printed circuit board substrate (27) on a first vacuum injection tool (24). The printed circuit board substrate (27) has at least one optoelectronic component mounted thereon and has a solder mask (40) on a surface (46) facing away from the...

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Bibliographische Detailangaben
Hauptverfasser:	WANG, JI, GUBSER, SIMON, LEONG, KAM WAH, YU, QICHUAN, TEOH, YOONG KHENG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	Manufacturing optoelectronic modules includes supporting a printed circuit board substrate (27) on a first vacuum injection tool (24). The printed circuit board substrate (27) has at least one optoelectronic component mounted thereon and has a solder mask (40) on a surface (46) facing away from the first vacuum injection tool (24). The method includes causing the first vacuum injection tool (24) and a second vacuum injection tool (22) to be brought closer to one another such that a surface (46) of the second vacuum injection tool (22) is in contact with the solder mask (40). Subsequently, a first epoxy (100, 20) is provided, using a vacuum injection technique, in spaces (104) between the upper tool (22) and the solder mask (40).