Moisture-curing hot-melt adhesive composition and use thereof

A moisture-curable hot-melt adhesive composition comprises a polymer obtained by reacting the following components: 20 wt % to 60 wt % of bio-based polyester polyol; 1 wt % to 30 wt % of polycaprolactone polyol; 5 wt % to 50 wt % of petroleum-based polyester polyol; and 15 wt % to 25 wt % of polyiso...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KO, TZU-HENG, WEI, JIU-TAI, LIN, JUII
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	A moisture-curable hot-melt adhesive composition comprises a polymer obtained by reacting the following components: 20 wt % to 60 wt % of bio-based polyester polyol; 1 wt % to 30 wt % of polycaprolactone polyol; 5 wt % to 50 wt % of petroleum-based polyester polyol; and 15 wt % to 25 wt % of polyisocyanate; wherein the bio-based polyester polyol comprises a product of a dicarboxylic acid derived from biomass and a diol derived from biomass or petroleum; and the dicarboxylic acid is sebacic acid, succinic acid, or a combination thereof. A use of the aforesaid moisture-curable hot-melt adhesive composition is also provided.