Package substrate with conductive columns and manufacturing method thereof

The present application discloses a manufacturing method of a package substrate with conductive columns, including the following steps: A double-sided copper clad plate is provided. The double-sided copper clad plate has a thickness direction, including a first copper foil layer, a stripping layer, a first substrate layer and a second copper foil layer stacked in sequence along the thickness direction, and a plurality of conductive bodies are arranged through the first copper foil layer, the stripping layer and the first substrate layer. Remove the first copper foil layer and the conductive body protruding from the surface of the stripping layer to form a plurality of conductive columns. Remove the stripping layer and graphically shape the second copper foil layer to form a plurality of connection pads to obtain the first substrate. A second substrate is arranged on one side of the first substrate, the second substrate comprises a second substrate layer and a first line layer and a second line layer respectiv