COOLING SYSTEM

The present disclosure provides a cooling system, including an air-cooling device and a water-cooling device. The air-cooling device includes a first fan, an evaporator, a first condenser, and a second fan. The first fan is configured to blow hot air inside a rack into a first cooling room. The seco...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	YOU, SIANG-LIN, CHANG, RENUN, LAI, SHAO-HSUAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS SEMICONDUCTOR DEVICES WEAPONS
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Beschreibung
Zusammenfassung:	The present disclosure provides a cooling system, including an air-cooling device and a water-cooling device. The air-cooling device includes a first fan, an evaporator, a first condenser, and a second fan. The first fan is configured to blow hot air inside a rack into a first cooling room. The second fan is configured to blow outside air into a second cooling room. When the evaporator receives the hot air, the evaporator is configured to heat refrigerant into gaseous state and transmit the refrigerant to the first condenser. When the first condenser receives the outside air, the first condenser is configured to condense the refrigerant into liquid state and transmit the refrigerant to the evaporator. The water-cooling device includes a hydronic coil. The hydronic coil is configured to receive hot liquid from an electronic device in the rack and transmit cold liquid to the electronic device. When the hydronic coil receives the outside air, the hydronic coil is configured to cool down the hot liquid to the col