TWI832837B

[Problem to be Solved]Provided is a method capable of dividing a composite material without causing a crack in an end face of a brittle material layer after being divided, or serious thermal deterioration of an end face of the resin layer after being divided.[Solution]The present invention is a meth...

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Bibliographische Detailangaben
1. Verfasser: MATSUO, NAOYUKI
Format: Patent
Sprache:chi
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Zusammenfassung:[Problem to be Solved]Provided is a method capable of dividing a composite material without causing a crack in an end face of a brittle material layer after being divided, or serious thermal deterioration of an end face of the resin layer after being divided.[Solution]The present invention is a method for dividing a composite material 10 in which a brittle material layer 1 and a resin layer 2 are laminated, the method including: a resin removing step of radiating a laser light L1 oscillated from a CO2 laser source 20 to the resin layer along the scheduled dividing line DL of the composite material and thereby forming a processed groove 24 along the scheduled dividing line; a brittle material removing step of radiating a laser light L2 oscillated from an ultrashort pulse laser source 30 to the brittle material layer along the scheduled dividing line and thereby forming a processing mark 11 along the scheduled dividing line, after the resin removing step; and a composite material dividing step of dividing the c