WAFER PROCESSING SYSTEM

Disclosed is a wafer processing system comprising a processing tank, a cleaning device and a drying device. The processing tank has a cantilever rotating device and a dynamic balance correction device. The cantilever rotating device has a holding part for holding a wafer of a variety of specificatio...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CHANG, CHIA-OU, KOU, CHWUNG-SHAN, CHANG, CHIENNG
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:Disclosed is a wafer processing system comprising a processing tank, a cleaning device and a drying device. The processing tank has a cantilever rotating device and a dynamic balance correction device. The cantilever rotating device has a holding part for holding a wafer of a variety of specification parameters and causing the wafer to rotate along a rotating shaft of the cantilever rotating device. The dynamic balance correction device performs a corresponding dynamic balance correction on the cantilever rotating device, so that the cantilever rotating device is in a dynamic balance state during rotation. A dynamic nozzle unit of the cleaning device ejects a cleaning fluid to clean the rotating wafer. The drying device is used to dry the rotating wafer.