Nozzle type deposition apparatus

The present invention relates to a nozzle-type deposition apparatus. More specifically, according to the present invention, as a source for depositing a pattern is provided and deposited as many times as necessary for pattern deposition, an amount of the source used can be minimized. In addition, as...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	JUNG, YU JONG, DO, YOUNG WON, JANG, JAE YOUNG, SUL, BONG HO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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