Nozzle type deposition apparatus

The present invention relates to a nozzle-type deposition apparatus. More specifically, according to the present invention, as a source for depositing a pattern is provided and deposited as many times as necessary for pattern deposition, an amount of the source used can be minimized. In addition, as the source is supplied only to a region where the pattern is to be formed, precise pattern deposition is possible and diffusion of the source is prevented. Accordingly, a phenomenon in which the source is deposited in another area may be fundamentally prevented. Also, since a heating gas is utilized, clogging of a pipe and a nozzle to which the source is supplied can be prevented. In addition, as the source is supplied in a nozzle manner, the deposition apparatus can be configured simply and efficiently. The nozzle-type deposition apparatus of the present invention comprises: a laser module; a first nozzle; a second nozzle; a nozzle housing; and a heater unit.