Deposition mask and method for manufactuirng of the same

A mask for deposition according to an embodiment includes a deposition region for forming a deposition pattern, and a non-deposition region in addition to the deposition region. The deposition region includes a plurality of effective portions spaced apart from each other in a longitudinal direction,...

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Bibliographische Detailangaben
Hauptverfasser:	SON, HYO WON, CHO, SU HYEON, UM, TAE IN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A mask for deposition according to an embodiment includes a deposition region for forming a deposition pattern, and a non-deposition region in addition to the deposition region. The deposition region includes a plurality of effective portions spaced apart from each other in a longitudinal direction, and non-effective portions in addition to the effective portions. The effective portions include: a plurality of small surface holes formed on one surface thereof, and a plurality of large surface holes formed on the other surface opposite from the one surface; and through-holes for communicating the small surface holes and the large surface holes, and island portions between the plurality of through-holes. The non-effective portions include a plurality of first grooves spaced apart from each other. The first grooves are formed to be disposed apart from each other and constitute 10-60% of the total area of the non-effective portions.