Underfill material, semiconductor package, and method for producing semiconductor package

An underfill material contains an epoxy resin, a curing agent, and an inorganic fill material, and when a cured object is disposed for 1000 hours at 175°C, the component mass reduction rate obtained by subtracting the mass of the inorganic fill material from the total mass of the cured object is 1.0...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	SHIRAGAMI, MASASHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	An underfill material contains an epoxy resin, a curing agent, and an inorganic fill material, and when a cured object is disposed for 1000 hours at 175°C, the component mass reduction rate obtained by subtracting the mass of the inorganic fill material from the total mass of the cured object is 1.00 mass% or less.