Conductive laminated structure and foldable electronic device
A conductive laminated structure includes a conductive layer and a thickened layer The conductive layer extends along a first direction. The thickened layer is disposed over or under the conductive layer. The conductive laminated structure can withstand more than 40,000 folding times without breakin...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | A conductive laminated structure includes a conductive layer and a thickened layer The conductive layer extends along a first direction. The thickened layer is disposed over or under the conductive layer. The conductive laminated structure can withstand more than 40,000 folding times without breaking when the radius of curvature R = 3 mm, the folding direction is perpendicular or parallel to the first direction, and the folding angle is 180DEG. A foldable electronic device is also provided herein. |
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