TWI825820B

The present invention relates to a special-shaped microtube inner hole grinding and polishing equipment structure, which includes: a pumping unit configured to pump an electrolyte containing magnetically conductive abrasive grains into a tube body of a workpiece to be processed; a driving unit configured to rotate the workpiece; a magnetic field part disposed between two clamps of the non-conducting clamp set, in which the magnetic field part can change the position of the electrolyte; and an electrode set configured to allow the electrolyte to be electroplated on an internal surface of the tube body of the workpiece, and cut and grind the softened electroplated surface through the magnetically conductive abrasive grains.