Apparatus for and method of in situ clamp surface roughening
Disclosed is a dedicated roughening substrate provided with abrasive element useful for in situ roughening of a surface of a clamp in a semiconductor photolithography apparatus. Also disclosed is a method of using the roughening substrate in which the roughening substrate is loaded, positioned oppos...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | Disclosed is a dedicated roughening substrate provided with abrasive element useful for in situ roughening of a surface of a clamp in a semiconductor photolithography apparatus. Also disclosed is a method of using the roughening substrate in which the roughening substrate is loaded, positioned opposite the clamp, and then pressed against the clamp and moved laterally. |
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