Electrical connection structure
The invention provides an electrical connection structure. The electrical connection structure comprises a first substrate, a first conductive pad, a second substrate, a second conductive pad, a through hole and a conductive material, the first conductive pad is disposed on the first substrate, wher...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The invention provides an electrical connection structure. The electrical connection structure comprises a first substrate, a first conductive pad, a second substrate, a second conductive pad, a through hole and a conductive material, the first conductive pad is disposed on the first substrate, wherein the first conductive pad includes a first upper surface. The second conductive pad is disposed on the second substrate, wherein the second conductive pad includes a second upper surface. The through hole passes through the first substrate and exposes a part of the second upper surface. The conductive material is partially disposed in the through hole, wherein the conductive material includes a narrowest portion and a first contact portion in contact with the second upper surface. The length of the first contact portion is greater than the length of the narrowest portion in a cross-sectional view. |
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