WAFER CARRYING DEVICE

WAFER CARRYING DEVICE

A wafer carrying device comprises a wafer carrier which includes a main plate and a plurality of sub plates. The main plate has a first upper surface, a first lower surface and a plurality of recess. Each of the recesses forms an upper opening at the first upper surface. Each of the sub plates has a...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: WU, HAN-ZONG, TSAO, CHENG-HAN
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A wafer carrying device comprises a wafer carrier which includes a main plate and a plurality of sub plates. The main plate has a first upper surface, a first lower surface and a plurality of recess. Each of the recesses forms an upper opening at the first upper surface. Each of the sub plates has a carrying recess for accommodating a wafer. Each of the sub plates are respectively placed in each of the recesses. Thereby, the sub plate can be detached from the main plate.