Delamination module and gas assisted bonding equipment including the same

Embodiments of the present invention provide a de-lamination module capable of effectively stripping a film from a wafer and gas-assisted bonding equipment including the same. According to the present invention, the de-lamination module for stripping a film attached to a wafer in gas-assisted bonding equipment comprises: a tape supply part supplying tape for stripping the film; a film stripping device using the tape to strip the film from the wafer; and a tape collection part collecting the tape to which the film is attached. The film stripping device includes: a chuck allowing the wafer to which the film is attached to be placed on an upper portion thereof, and configured to be moved in a horizontal direction; a stripping roller bringing the tape for stripping the film from the wafer into contact with the film, and configured to be rotated at a speed corresponding to the moving speed of the chuck; and a stripping bar adjusting the stripping angle between the wafer and the film to which the tape is attached.