Polyimide resin, positive-type photosensitive resin composition comprising the same and method for preparing the same

An exemplary embodiment of the present application provides a polyimide resin in which the functional group represented by Chemical Formula 1 or 2 is bonded to at least one end of the polyimide resin.

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Bibliographische Detailangaben
Hauptverfasser:	LIM, MINYOUNG, SUNG, JIYEON
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	An exemplary embodiment of the present application provides a polyimide resin in which the functional group represented by Chemical Formula 1 or 2 is bonded to at least one end of the polyimide resin.