WAFER CLEANING APPARATUS AND LEAKAGE DETECTION METHOD THEREOF

WAFER CLEANING APPARATUS AND LEAKAGE DETECTION METHOD THEREOF

A wafer cleaning apparatus includes a chamber, a rotary chuck, a liquid spray post, a top lid, a liquid conveying pipeline, a protection pipeline, and a leak sensor. The rotary chuck is located in the chamber, and is configured to attach a wafer cassette. The liquid spray post is located in the cham...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: PENG, KUO-HAO
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CLEANING
CLEANING IN GENERAL
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
PREVENTION OF FOULING IN GENERAL
SEMICONDUCTOR DEVICES
TRANSPORTING
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Beschreibung
Zusammenfassung:A wafer cleaning apparatus includes a chamber, a rotary chuck, a liquid spray post, a top lid, a liquid conveying pipeline, a protection pipeline, and a leak sensor. The rotary chuck is located in the chamber, and is configured to attach a wafer cassette. The liquid spray post is located in the chamber. The liquid spray post faces the wafer cassette. The top lid is located on the chamber. The liquid spray post is disposed on the bottom surface of the top lid. The liquid conveying pipeline is located outside the chamber and communicates the liquid spray post, and is disposed along a bottom surface and an external sidewall of the top lid. The protection pipeline sleeves on the liquid conveying pipeline. The leak sensor is located in the protection pipeline, and is located under the lowest section of the liquid conveying pipeline.