TWI822354B

A vacuum lock system, a semiconductor processing apparatus and a substrate transfer method, the semiconductor processing apparatus comprising a plurality of processing chambers connected to a vacuum transfer chamber, the vacuum transfer chamber being connected to a front end module through at least one vacuum lock system, the vacuum lock system comprising a multi-stage vacuum lock and a multi-stage transition chamber, every two adjacent vacuum locks are connected through a transition cavity, and a transition air pressure environment is provided by additionally arranging multiple stages of transition cavities between the atmospheric pressure environment where the front-end module is located and the vacuum environment where the vacuum transmission cavity is located. Therefore, the waiting time for substrate transmission is shortened, the throughput is improved, the air pressure in the transition cavity is kept stable, airflow disturbance is avoided, and defects are reduced.