TWI822074B

The present invention provides a plating film that exhibits good adhesion to glass substrates. The present invention is a plating film comprising an oxide layer, an electroless plating film, and an electrolytic copper plating film in this order.

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Bibliographische Detailangaben
Hauptverfasser:	NAGAO, TOSHIMITSU, FUKU, SHUHEI, KATAYAMA, JUNICHI, HIROOKA, ASUKA, SAKATA, TOSHIHIKO, HAYAMIZU, MASAHITO, TSUKUDA, MAYU, SHIMADA, KAZUYA
Format:	Patent
Sprache:	chi
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GLASS JOINING GLASS TO GLASS OR OTHER MATERIALS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MINERAL OR SLAG WOOL PRINTED CIRCUITS SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS
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Beschreibung
Zusammenfassung:	The present invention provides a plating film that exhibits good adhesion to glass substrates. The present invention is a plating film comprising an oxide layer, an electroless plating film, and an electrolytic copper plating film in this order.