Wafer profiling for etching system

A substrate etching system includes a support to hold a wafer in a face-up orientation, a dispenser arm movable laterally across the wafer on the support, the dispenser arm supporting a delivery port to selectively dispense a liquid etchant onto a portion of a top face of the wafer, and a monitoring...

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Bibliographische Detailangaben
Hauptverfasser: CHEUNG, JEFFREY CHI, GHEKIERE, JOHN, YOUNG, RAY, SURDOCK, DAVID P, LEONHARD, JERRY D, SHAFER, BENJAMAN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:A substrate etching system includes a support to hold a wafer in a face-up orientation, a dispenser arm movable laterally across the wafer on the support, the dispenser arm supporting a delivery port to selectively dispense a liquid etchant onto a portion of a top face of the wafer, and a monitoring system comprising a probe movable laterally across the wafer on the support.