TWI821580B

More specifically, the purpose of the present invention is to detect penetration of a hole when drilling a hole on a glass substrate by using laser. A laser processing device comprises: a table where the substrate to be processed is mounted; a laser radiation system radiating laser to the substrate;...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SAEKI, YUKI, ITO, YASUSHI, NISHIBE, TATSUYA, ICHIKAWA, KENICHI
Format:	Patent
Sprache:	chi
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	More specifically, the purpose of the present invention is to detect penetration of a hole when drilling a hole on a glass substrate by using laser. A laser processing device comprises: a table where the substrate to be processed is mounted; a laser radiation system radiating laser to the substrate; and a control unit controlling each portion of the device for performing processing operation. According to the laser processing device, the control unit detects that a light detection level on a cross-section of the substrate is decreased at a predetermined level during processing operation so as to detect the penetration of the hole.