Thermally curable two part processing adhesive composition

Two part, curable, liquid adhesive compositions have a Part A and a Part B. Part A includes a first free radically polymerizable liquid composition, and a first peroxide initiator composition that generates free radicals upon reaction with an amine. Part B includes a second free radically polymeriza...

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Bibliographische Detailangaben
Hauptverfasser:	LARSON, ERIC GEORGE, ROBERTS, RALPH RODNEY, LEE, ANDREW BRUCE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	Two part, curable, liquid adhesive compositions have a Part A and a Part B. Part A includes a first free radically polymerizable liquid composition, and a first peroxide initiator composition that generates free radicals upon reaction with an amine. Part B includes a second free radically polymerizable liquid composition, a second peroxide initiator that generates free radicals at a temperature of greater than 150°C and is not amine-reactive, and an amine. Mixtures of Part A and Part B can be heated to a temperature of at least 55°C to partially cure, and heated to a temperature of at least 150°C to fully cure.