Adhesive resin sheet, printed wiring board, and electronic equipment

The objective of the present disclosure is to provide an adhesive resin sheet that shows an excellent loss tangent in high frequency bands (10 GHz, 20 GHz, 40 GHz) and exhibits high migration resistance and excellent bendability after a solder reflow step. The problem is solved by the provision of an adhesive resin sheet that satisfies the following i to iv when the adhesive resin sheet is heated at 180℃ for one hour. i: At 23℃, the loss tangent at a measurement frequency of 10 GHz is less than or equal to 0.005. ii: At 23℃, the loss tangent at a measurement frequency of 20 GHz is less than or equal to 0.007. iii: At 23℃, the loss tangent at a measurement frequency of 40 GHz is less than or equal to 0.01. iv: When the mass reduction rate measured in compliance with thermogravimetry defined in JIS K 7120 using an inflow gas of nitrogen, a measurement temperature range of 25℃ to 500℃, and a heating rate of 10℃/min is 5%, the temperature is greater than or equal to 280℃.