TWI819278B

Provided is a method for manufacturing an electromagnetic-wave blocking package, said method including curing a conductive composition filling a groove section formed in a sealing layer, whereby it is possible to form a compartment shield layer smooth with a top surface of the sealing layer. This method for manufacturing an electromagnetic-wave blocking package includes: a sealing step for mounting a plurality of electronic components on a substrate, loading a sealing material onto this substrate, and curing the sealing material, thereby forming a sealing layer for sealing the electronic components; a groove forming step for cutting the sealing layer between the plurality of electronic components, thereby forming a groove section; a masking step for forming a protective film on a top surface of the sealing layer so as to cover at least a top surface opening of the groove section; a filling step for piercing the protective film with a nozzle leading-end section of a conductive-composition discharging device, i