TWI819063B

The present invention relates to an etching solution composition, which provides an etching solution composition capable of minimizing damage to the lower metal film in the process of etching the upper metal film. According to the etching solution composition of the present invention, the damage of...

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Bibliographische Detailangaben
Hauptverfasser:	KIM, HEE TAE, KIM, IK JOON, LEE, HEE WOONG, JIN, YUN TAE, EUN, HEE CHUN, KIM, SE HOON
Format:	Patent
Sprache:	chi
Schlagworte:	ADHESIVES CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL DYES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NATURAL RESINS NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE PAINTS POLISHES
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Beschreibung
Zusammenfassung:	The present invention relates to an etching solution composition, which provides an etching solution composition capable of minimizing damage to the lower metal film in the process of etching the upper metal film. According to the etching solution composition of the present invention, the damage of the lower film can be suppressed in the etching process of the upper film, so that the generation of metal precipitates can be minimized, thereby preventing skew from occurring and improving the process efficiency.