TWI818164B

The purpose of the present invention is to provide a novel composite copper member. Provided by the present invention is a composite copper member which has a metal layer comprising metal other than copper formed on micro irregularities including copper and copper oxide on at least some of the surfa...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SATO, MAKIKO, KOKAJI, YOSHINOBU
Format:	Patent
Sprache:	chi
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING
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Beschreibung
Zusammenfassung:	The purpose of the present invention is to provide a novel composite copper member. Provided by the present invention is a composite copper member which has a metal layer comprising metal other than copper formed on micro irregularities including copper and copper oxide on at least some of the surfaces of the copper member, wherein the surface of the composite copper member where the metal layer is formed has micro irregularities, the mean length of roughness profile elements (Rsm) of the surface of the composite copper member is 550 nm or less, the surface-area ratio is 1.3 to 2.2, and the average thickness of the metal layer in the vertical direction is 15 nm to 150 nm.