Sputtering apparatus

A sputtering apparatus according to an embodiment may comprise: a stage rotatable while supporting a substrate having a fine pattern; a target facing the substrate; and a blocking member including a blocking body arranged between the stage and the target, and a through hole which is formed in the bl...

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Bibliographische Detailangaben
Hauptverfasser:	YAGINUMA, KANJI, JANG, YONG SEOK, PARK, DA HEE, JEONG, BYEONG HWA, IWAHASHI, TERUAKI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A sputtering apparatus according to an embodiment may comprise: a stage rotatable while supporting a substrate having a fine pattern; a target facing the substrate; and a blocking member including a blocking body arranged between the stage and the target, and a through hole which is formed in the blocking body and through which at least a portion of film-forming materials that are separated from the target and proceed to the substrate passes.