METHOD FOR MANUFACTURING UNDER-SCREEN BIOMETRIC IDENTIFICATION MODULE AND METHOD FOR MANUFACTURING UNDER-SCREEN BIOMETRIC IDENTIFICATION DEVICE
Disclosed is a method for manufacturing an under-screen biometric identification module, comprising: providing a carrier board; forming an electrode array on the carrier board; forming a piezoelectric material layer and covering the electrode array, so that the piezoelectric material layer physical...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | Disclosed is a method for manufacturing an under-screen biometric identification module, comprising: providing a carrier board; forming an electrode array on the carrier board; forming a piezoelectric material layer and covering the electrode array, so that the piezoelectric material layer physical is in connection with the electrode array to form a stacked structure; performing a poling step to polarize the piezoelectric material layer of the stacked structure; and performing a separation step to make the stacked structure separate from the carrier board. |
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