Epoxy resin composition for encapsulation of semiconductor devices and semiconductor device

The present invention provides an epoxy resin composition for sealing a semiconductor device, comprising a first inorganic filler which includes one or more metal particles selected from the group consisting of copper, nickel, aluminum, silver and gold, coated with one or more selected from epoxy re...

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Bibliographische Detailangaben
Hauptverfasser:	YOON, JI AH, LEE, JI HYE, KIM, MIN SOO, LEE, DONG HWAN, PARK, YONG YEOP, BAE, KYOUNG CHUL, HONG, IL GEUN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	The present invention provides an epoxy resin composition for sealing a semiconductor device, comprising a first inorganic filler which includes one or more metal particles selected from the group consisting of copper, nickel, aluminum, silver and gold, coated with one or more selected from epoxy resins, curing agents, and silica and alumina; and a semiconductor device sealed by using the composition.