Photosensitive resin composition, dry film, solder resist, and printed wiring board

This invention provides a type of photosensitive resin composition that can increase developability and deep curing properties, and can also improve appearance and reflectance of a solder resist layer, even though it contains titanium oxide. This photosensitive resin composition contains: a carboxyl...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HASHIMOTO, SOICHI, MAEGAWA, SAKINA, ARAI, TAKASHI, HIGUCHI, MICHIYA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS
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