Photosensitive resin composition, dry film, solder resist, and printed wiring board

This invention provides a type of photosensitive resin composition that can increase developability and deep curing properties, and can also improve appearance and reflectance of a solder resist layer, even though it contains titanium oxide. This photosensitive resin composition contains: a carboxyl...

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Bibliographische Detailangaben
Hauptverfasser:	HASHIMOTO, SOICHI, MAEGAWA, SAKINA, ARAI, TAKASHI, HIGUCHI, MICHIYA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	This invention provides a type of photosensitive resin composition that can increase developability and deep curing properties, and can also improve appearance and reflectance of a solder resist layer, even though it contains titanium oxide. This photosensitive resin composition contains: a carboxyl group-containing resin (A), a photopolymerization initiator (B), a photopolymerizable compound (C), an epoxy resin (D) and a titanium oxide (E). The carboxyl group-containing resin (A) contains a carboxyl group-containing residue and an ethylenically unsaturated group located in a side chain, and contains a vinyl polymer having a weight-average molecular weight of 10,000 to 100,000, and the carboxyl group-containing resin (A) contains an oligomer fraction having a molecular weight of 450 to 1,000. The proportion of the titanium oxide (E) is more than 20 parts by mass relative to 100 parts by mass of the carboxyl group-containing resin (A).