TWI815196B

A mounting board includes an electronic component having at least a pair of first terminals, and a circuit board having at least a pair of second terminals. The first terminal and the second terminal are bonded to each other by a bonding material. The first terminal, the second terminal, and the bon...

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Bibliographische Detailangaben
Hauptverfasser: MITOSE, TOMOHISA, SEKI, AKIKO, TANIGUCHI, SUSUMU, KAWABATA, KENICHI
Format: Patent
Sprache:chi
Schlagworte:
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Beschreibung
Zusammenfassung:A mounting board includes an electronic component having at least a pair of first terminals, and a circuit board having at least a pair of second terminals. The first terminal and the second terminal are bonded to each other by a bonding material. The first terminal, the second terminal, and the bonding material are disposed inside a recessed portion formed in a resin layer such that the periphery thereof is surrounded by the resin layer. When a total thickness of the first terminal, the second terminal, and the bonding material is a dimension h1, the dimension h1 is 1 μm to 20 μm. When a width of the first terminal is a dimension d1 and a width of the recessed portion of the resin layer is a dimension d2, a value of (dimension d2-dimension d1) is 10 μm or smaller.