Liquid cooling loop heat sink and cooling system having the same
A liquid cooling loop heat sink and cooling system having the same are provided. The heat sink has a power-allocate assembly and two gather-transport members. The power-allocate assembly has a first water reservoir for heat dissipation, a second water reservoir for heat dissipation, a plurality of h...
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| creator | CHIU, YAO-TSUNG |
| description | A liquid cooling loop heat sink and cooling system having the same are provided. The heat sink has a power-allocate assembly and two gather-transport members. The power-allocate assembly has a first water reservoir for heat dissipation, a second water reservoir for heat dissipation, a plurality of heat dissipation pumps arranged on the first water reservoir for heat dissipation, and a plurality of tandem pipes and cooling heads corresponding to each heat dissipation pump. The two gather-transport members respectively connect to the first water reservoir for heat dissipation and the second water reservoir for heat dissipation, and are respectively arranged on two sides of the power-allocate assembly. Wherein, the tandem pipes tandem connect to the cooling heads to connect between the first water reservoir for heat dissipation and the second water reservoir for heat dissipation. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TWI815096BB</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TWI815096BB</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TWI815096BB3</originalsourceid><addsrcrecordid>eNrjZHDwySwszUxRSM7Pz8nMS1fIyc8vUMhITSxRKM7My1ZIzENIFVcWl6TmKmQkloF4JRmpCsWJuak8DKxpiTnFqbxQmptBwc01xNlDN7UgPz61uCAxOTUvtSQ-JNzTwtDUwNLMycmYCCUAUzsxFg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Liquid cooling loop heat sink and cooling system having the same</title><source>esp@cenet</source><creator>CHIU, YAO-TSUNG</creator><creatorcontrib>CHIU, YAO-TSUNG</creatorcontrib><description>A liquid cooling loop heat sink and cooling system having the same are provided. The heat sink has a power-allocate assembly and two gather-transport members. The power-allocate assembly has a first water reservoir for heat dissipation, a second water reservoir for heat dissipation, a plurality of heat dissipation pumps arranged on the first water reservoir for heat dissipation, and a plurality of tandem pipes and cooling heads corresponding to each heat dissipation pump. The two gather-transport members respectively connect to the first water reservoir for heat dissipation and the second water reservoir for heat dissipation, and are respectively arranged on two sides of the power-allocate assembly. Wherein, the tandem pipes tandem connect to the cooling heads to connect between the first water reservoir for heat dissipation and the second water reservoir for heat dissipation.</description><language>chi ; eng</language><subject>BLASTING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HEAT EXCHANGE IN GENERAL ; HEATING ; LIGHTING ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MECHANICAL ENGINEERING ; PRINTED CIRCUITS ; WEAPONS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230911&DB=EPODOC&CC=TW&NR=I815096B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25544,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230911&DB=EPODOC&CC=TW&NR=I815096B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHIU, YAO-TSUNG</creatorcontrib><title>Liquid cooling loop heat sink and cooling system having the same</title><description>A liquid cooling loop heat sink and cooling system having the same are provided. The heat sink has a power-allocate assembly and two gather-transport members. The power-allocate assembly has a first water reservoir for heat dissipation, a second water reservoir for heat dissipation, a plurality of heat dissipation pumps arranged on the first water reservoir for heat dissipation, and a plurality of tandem pipes and cooling heads corresponding to each heat dissipation pump. The two gather-transport members respectively connect to the first water reservoir for heat dissipation and the second water reservoir for heat dissipation, and are respectively arranged on two sides of the power-allocate assembly. Wherein, the tandem pipes tandem connect to the cooling heads to connect between the first water reservoir for heat dissipation and the second water reservoir for heat dissipation.</description><subject>BLASTING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HEAT EXCHANGE IN GENERAL</subject><subject>HEATING</subject><subject>LIGHTING</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MECHANICAL ENGINEERING</subject><subject>PRINTED CIRCUITS</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHDwySwszUxRSM7Pz8nMS1fIyc8vUMhITSxRKM7My1ZIzENIFVcWl6TmKmQkloF4JRmpCsWJuak8DKxpiTnFqbxQmptBwc01xNlDN7UgPz61uCAxOTUvtSQ-JNzTwtDUwNLMycmYCCUAUzsxFg</recordid><startdate>20230911</startdate><enddate>20230911</enddate><creator>CHIU, YAO-TSUNG</creator><scope>EVB</scope></search><sort><creationdate>20230911</creationdate><title>Liquid cooling loop heat sink and cooling system having the same</title><author>CHIU, YAO-TSUNG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI815096BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>BLASTING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HEAT EXCHANGE IN GENERAL</topic><topic>HEATING</topic><topic>LIGHTING</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MECHANICAL ENGINEERING</topic><topic>PRINTED CIRCUITS</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>CHIU, YAO-TSUNG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHIU, YAO-TSUNG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Liquid cooling loop heat sink and cooling system having the same</title><date>2023-09-11</date><risdate>2023</risdate><abstract>A liquid cooling loop heat sink and cooling system having the same are provided. The heat sink has a power-allocate assembly and two gather-transport members. The power-allocate assembly has a first water reservoir for heat dissipation, a second water reservoir for heat dissipation, a plurality of heat dissipation pumps arranged on the first water reservoir for heat dissipation, and a plurality of tandem pipes and cooling heads corresponding to each heat dissipation pump. The two gather-transport members respectively connect to the first water reservoir for heat dissipation and the second water reservoir for heat dissipation, and are respectively arranged on two sides of the power-allocate assembly. Wherein, the tandem pipes tandem connect to the cooling heads to connect between the first water reservoir for heat dissipation and the second water reservoir for heat dissipation.</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS WEAPONS |
| title | Liquid cooling loop heat sink and cooling system having the same |
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