Liquid cooling loop heat sink and cooling system having the same

A liquid cooling loop heat sink and cooling system having the same are provided. The heat sink has a power-allocate assembly and two gather-transport members. The power-allocate assembly has a first water reservoir for heat dissipation, a second water reservoir for heat dissipation, a plurality of h...

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Bibliographische Detailangaben
1. Verfasser:	CHIU, YAO-TSUNG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS WEAPONS
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Beschreibung
Zusammenfassung:	A liquid cooling loop heat sink and cooling system having the same are provided. The heat sink has a power-allocate assembly and two gather-transport members. The power-allocate assembly has a first water reservoir for heat dissipation, a second water reservoir for heat dissipation, a plurality of heat dissipation pumps arranged on the first water reservoir for heat dissipation, and a plurality of tandem pipes and cooling heads corresponding to each heat dissipation pump. The two gather-transport members respectively connect to the first water reservoir for heat dissipation and the second water reservoir for heat dissipation, and are respectively arranged on two sides of the power-allocate assembly. Wherein, the tandem pipes tandem connect to the cooling heads to connect between the first water reservoir for heat dissipation and the second water reservoir for heat dissipation.