Method for fabricating semiconductor device

A method for fabricating semiconductor device includes the steps of: forming a gate structure on a substrate; forming a source/drain region adjacent to two sides of the gate structure; forming an interlayer dielectric (ILD) layer on the gate structure; forming a contact hole in the ILD layer to expo...

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Bibliographische Detailangaben
Hauptverfasser: YI, YEN-TSAI, CHEN, LI-HAN, CHIOU, JIN-YAN, TSAI, WEIUAN, KE, HSIANG-WEN
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:A method for fabricating semiconductor device includes the steps of: forming a gate structure on a substrate; forming a source/drain region adjacent to two sides of the gate structure; forming an interlayer dielectric (ILD) layer on the gate structure; forming a contact hole in the ILD layer to expose the source/drain region; forming a barrier layer in the contact hole; performing an anneal process; and performing a plasma treatment process to inject nitrogen into the contact hole.