TWI814885B

To provide an aqueous dispersion for chemical mechanical polishing, having excellent stability, capable of polishing a surface to be polished at a high speed while suppressing excessive etching of the surface to be polished including a wiring metal material and a barrier metal material.SOLUTION: One...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	YAMANAKA, TATSUYA, HIRAI, YUUJI, MITSUMOTO, KIYOTAKA, OKAMOTO, MASASHI, KUSHIDA, YUUKI
Format:	Patent
Sprache:	chi
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS POLISHES POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	To provide an aqueous dispersion for chemical mechanical polishing, having excellent stability, capable of polishing a surface to be polished at a high speed while suppressing excessive etching of the surface to be polished including a wiring metal material and a barrier metal material.SOLUTION: One embodiment of the aqueous dispersion for chemical mechanical polishing according to the present invention, includes: (A) an abrasive; (B) an iron salt; and (C) a compound having a hydroxyl group and a carboxyl group, and at least one selected from a group composed of salts of the same and has pH of 7 or more and 14 or less.SELECTED DRAWING: None