TWI813674B

The purpose of the present invention is to provide a wafer machining method capable of cutting a wafer, in which a plurality of devices formed of a metal pattern are formed by deposition on an upper surface of a glass substrate, without deteriorating the quality of the devices. The wafer machining method of the present invention comprises: a sheet pressing process of attaching a polyolefin-based or polyester-based sheet to the surface of a wafer, heating the same, and heat-compressing the sheet on the surface of the wafer; a wafer supporting process of bonding the rear surface of the wafer with a dicing tape and bonding, to the dicing tape, an annular frame having an opening accommodating the wafer; a dividing process of dividing the wafer into individual devices by cutting the wafer together with the sheet along a division-scheduled line of the wafer by rotating a cutting blade, having an annular cutting blade on the outer circumference thereof, while supplying cutting water; and a sheet peeling process of p