Bonding structure

A bonding structure includes a transparent substrate, an identification module, and an adhesive component. A thickness of the identification module is equal to or less than 0.3 mm. The adhesive component is attached between the transparent substrate and the identification module. At least one of a 1...

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Bibliographische Detailangaben
1. Verfasser:	CHANG, YI-SHAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING FREQUENCY-CHANGING NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:	A bonding structure includes a transparent substrate, an identification module, and an adhesive component. A thickness of the identification module is equal to or less than 0.3 mm. The adhesive component is attached between the transparent substrate and the identification module. At least one of a 180 degree peeling adhesive strength between the adhesive component and the transparent substrate and a 180 degree peeling adhesive strength between the adhesive component and the identification module is less than 2 N/inch.