Electronic device and thermal insulation module thereof

Electronic device and thermal insulation module thereof

An electronic device includes an outer casing, a sensing module, and a thermal insulation module. The sensing module includes a circuit board and a sensing unit and a heating unit which are disposed on the circuit board. The heating unit is configured to heat the sensing unit. The thermal insulation...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HUANG, PO-LIANG, WU, WENIN, LIU, YOU-XIN
Format: Patent
Sprache:chi ; eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:An electronic device includes an outer casing, a sensing module, and a thermal insulation module. The sensing module includes a circuit board and a sensing unit and a heating unit which are disposed on the circuit board. The heating unit is configured to heat the sensing unit. The thermal insulation module is accommodated within the outer casing and includes a casing assembly and a thermal insulation filler. The sensing module is accommodated within the casing assembly. The thermal insulation filler is arranged between the circuit board of the sensing module and an inner surface of the casing assembly so as to contact and cover the heating unit.