Molding method for operating molding device

A molding method includes providing a molding device, wherein the molding device includes a first mold and a second mold corresponding to the first mold; moving the first mold towards the second mold to form a first mold cavity; supplying a gas to the first mold cavity; injecting a material into the...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: LEE, YIUNG, YEH, LIANG-HUI, CHEN, CHING-HAO
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A molding method includes providing a molding device, wherein the molding device includes a first mold and a second mold corresponding to the first mold; moving the first mold towards the second mold to form a first mold cavity; supplying a gas to the first mold cavity; injecting a material into the first mold cavity; and moving the first mold away from the second mold to form a second mold cavity and discharge at least a portion of the gas out of the molding device, wherein a first volume of the first mold cavity is substantially less than a second volume of the second mold cavity.