TWI811452B

The invention provides a diced die-bonding film that can achieve good pickup of a semiconductor chip with an adhesive layer after being cut even after a long period of time after manufacturing. The dicing die-bonding film includes: a dicing tape having a laminated structure including a base material...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SUGIMURA, TOSHIMASA, ONISHI, KENJI, FUKUI, AKIHIRO, TAKAMOTO, NAOHIDE
Format:	Patent
Sprache:	chi
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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