TWI811452B

The invention provides a diced die-bonding film that can achieve good pickup of a semiconductor chip with an adhesive layer after being cut even after a long period of time after manufacturing. The dicing die-bonding film includes: a dicing tape having a laminated structure including a base material and an adhesive layer; and, an adhesive layer detachably from the adhesive layer in the dicing tapeIn close contact, the pressure-sensitive adhesive layer includes a polymer having a structural part derived from a cross-linking agent including a radically polymerizable functional group and a firstfunctional group other than the radically polymerizable functional group, and maintains the radically polymerizable The state of radical polymerization of the functional group; and, a radical polymerization initiator having a second functional group capable of reacting with the first functional group.