TWI810429B

An objective of the present invention is to implement a highly precise cutting depth for a workpiece even though there is a variation in the height of a holding surface of a chuck table. A method for registering an origin point position of a cutting device comprises: a sheet holding step (ST1) of ho...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KOZAI, HIROHIKO, KITANO, TAKAYUKI
Format:	Patent
Sprache:	chi
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!