TWI810429B

TWI810429B

An objective of the present invention is to implement a highly precise cutting depth for a workpiece even though there is a variation in the height of a holding surface of a chuck table. A method for registering an origin point position of a cutting device comprises: a sheet holding step (ST1) of ho...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KOZAI, HIROHIKO, KITANO, TAKAYUKI
Format: Patent
Sprache:chi
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator KOZAI, HIROHIKO
KITANO, TAKAYUKI
description An objective of the present invention is to implement a highly precise cutting depth for a workpiece even though there is a variation in the height of a holding surface of a chuck table. A method for registering an origin point position of a cutting device comprises: a sheet holding step (ST1) of holding a dicing tape with a predetermined thickness on a holding surface of a chuck table; a cut mark forming step (ST2) of elevating a cutting unit by a predetermined distance in a Z-axis direction from a surface of the dicing tape in multiple XY coordinates of the chuck table to form a cut mark of a depth that does not completely cut the dicing tape with a cutting blade; and an origin point position registration step (ST3) of detecting the length of the plurality of cut marks for the XY coordinates by a camera unit, calculating the cut depth of the cut marks from the outer diameter of the cutting blade, and calculating an origin point position by corresponding the same to the XY coordinates from the cut depth and
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TWI810429BB</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TWI810429BB</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TWI810429BB3</originalsourceid><addsrcrecordid>eNrjZOAKCfe0MDQwMbJ04mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8QgNTsZEKAEACOcbeQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>TWI810429B</title><source>esp@cenet</source><creator>KOZAI, HIROHIKO ; KITANO, TAKAYUKI</creator><creatorcontrib>KOZAI, HIROHIKO ; KITANO, TAKAYUKI</creatorcontrib><description>An objective of the present invention is to implement a highly precise cutting depth for a workpiece even though there is a variation in the height of a holding surface of a chuck table. A method for registering an origin point position of a cutting device comprises: a sheet holding step (ST1) of holding a dicing tape with a predetermined thickness on a holding surface of a chuck table; a cut mark forming step (ST2) of elevating a cutting unit by a predetermined distance in a Z-axis direction from a surface of the dicing tape in multiple XY coordinates of the chuck table to form a cut mark of a depth that does not completely cut the dicing tape with a cutting blade; and an origin point position registration step (ST3) of detecting the length of the plurality of cut marks for the XY coordinates by a camera unit, calculating the cut depth of the cut marks from the outer diameter of the cutting blade, and calculating an origin point position by corresponding the same to the XY coordinates from the cut depth and</description><language>chi</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230801&amp;DB=EPODOC&amp;CC=TW&amp;NR=I810429B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230801&amp;DB=EPODOC&amp;CC=TW&amp;NR=I810429B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KOZAI, HIROHIKO</creatorcontrib><creatorcontrib>KITANO, TAKAYUKI</creatorcontrib><title>TWI810429B</title><description>An objective of the present invention is to implement a highly precise cutting depth for a workpiece even though there is a variation in the height of a holding surface of a chuck table. A method for registering an origin point position of a cutting device comprises: a sheet holding step (ST1) of holding a dicing tape with a predetermined thickness on a holding surface of a chuck table; a cut mark forming step (ST2) of elevating a cutting unit by a predetermined distance in a Z-axis direction from a surface of the dicing tape in multiple XY coordinates of the chuck table to form a cut mark of a depth that does not completely cut the dicing tape with a cutting blade; and an origin point position registration step (ST3) of detecting the length of the plurality of cut marks for the XY coordinates by a camera unit, calculating the cut depth of the cut marks from the outer diameter of the cutting blade, and calculating an origin point position by corresponding the same to the XY coordinates from the cut depth and</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOAKCfe0MDQwMbJ04mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8QgNTsZEKAEACOcbeQ</recordid><startdate>20230801</startdate><enddate>20230801</enddate><creator>KOZAI, HIROHIKO</creator><creator>KITANO, TAKAYUKI</creator><scope>EVB</scope></search><sort><creationdate>20230801</creationdate><title>TWI810429B</title><author>KOZAI, HIROHIKO ; KITANO, TAKAYUKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI810429BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>KOZAI, HIROHIKO</creatorcontrib><creatorcontrib>KITANO, TAKAYUKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KOZAI, HIROHIKO</au><au>KITANO, TAKAYUKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>TWI810429B</title><date>2023-08-01</date><risdate>2023</risdate><abstract>An objective of the present invention is to implement a highly precise cutting depth for a workpiece even though there is a variation in the height of a holding surface of a chuck table. A method for registering an origin point position of a cutting device comprises: a sheet holding step (ST1) of holding a dicing tape with a predetermined thickness on a holding surface of a chuck table; a cut mark forming step (ST2) of elevating a cutting unit by a predetermined distance in a Z-axis direction from a surface of the dicing tape in multiple XY coordinates of the chuck table to form a cut mark of a depth that does not completely cut the dicing tape with a cutting blade; and an origin point position registration step (ST3) of detecting the length of the plurality of cut marks for the XY coordinates by a camera unit, calculating the cut depth of the cut marks from the outer diameter of the cutting blade, and calculating an origin point position by corresponding the same to the XY coordinates from the cut depth and</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi
recordid cdi_epo_espacenet_TWI810429BB
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title TWI810429B
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-29T19%3A54%3A05IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KOZAI,%20HIROHIKO&rft.date=2023-08-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETWI810429BB%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true