TWI810329B

The present invention relates to a metal clad laminate in which a polyimide film is filled without irregularities on uneven of a surface of a metal foil, and which has high adhesion between the polyimide film and the metal foil. The metal clad laminate (100) is produced by overlapping the polyimide...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	HIRAISHI, KATSUFUMI, II, MASAKAZU, TERASHIMA, MADOKA, KANEKO, KAZUAKI, KOMINE, SHINJI, NISHIYAMA, TEPPEI
Format:	Patent
Sprache:	chi
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
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Beschreibung
Zusammenfassung:	The present invention relates to a metal clad laminate in which a polyimide film is filled without irregularities on uneven of a surface of a metal foil, and which has high adhesion between the polyimide film and the metal foil. The metal clad laminate (100) is produced by overlapping the polyimide film (10) and the metal foil (20) as a metal foil and continuously passing between a pair of press rolls (30, 40), and thermally compressing the polyimide film (10) and the metal foil (20). While a press surface of at least one side of the press roll (30) between the pair of press rolls (30, 40) is coated with a coating layer 50 as a film-shaped buffer movable in synchronization with the press roll (30), and thermal compression is performed.