TWI810250B

Disclosed is an electroplating apparatus for depositing metal on a substrate, which comprises a membrane frame, a catholyte inlet pipe and a center cap. The membrane frame has a center passage which passes through the center of the membrane frame. The catholyte inlet pipe is connected to the center...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LU, CHEN-HUA, JIA, ZHAO-WEI, WANG, HUI, YANG, HONGAO, WANG, JIAN
Format:	Patent
Sprache:	chi
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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