TWI810250B

Disclosed is an electroplating apparatus for depositing metal on a substrate, which comprises a membrane frame, a catholyte inlet pipe and a center cap. The membrane frame has a center passage which passes through the center of the membrane frame. The catholyte inlet pipe is connected to the center passage of the membrane frame. The center cap is fixed at the center of the membrane frame and covers the center passage of the membrane frame. The top of the center cap has a plurality of first holes. The catholyte inlet pipe supplies catholyte to the center cap through the center passage of the membrane frame, and the catholyte is supplied to a center area of the substrate through the first holes of the center cap.