Composite sheet for forming protective film and method for manufacturing semiconductor chip
Provided is a composite sheet for forming a protective film, the sheet comprising: a support sheet and an energy-ray-curable protective film-forming film provided on the support sheet, wherein the protective film-forming film includes an energy-ray-curable component (a0) and a non-energy-ray-curable...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | Provided is a composite sheet for forming a protective film, the sheet comprising: a support sheet and an energy-ray-curable protective film-forming film provided on the support sheet, wherein the protective film-forming film includes an energy-ray-curable component (a0) and a non-energy-ray-curable component (b), a layer in the support sheet, the layer being is in contact with the protective film-forming film includes a resin component (X), an HSP distance R12 between the non-energy-ray-curable component (b) and the resin component (X) is 6.7 or more and when an HSP space is defined and a Hansen dissolving sphere of the non-energy-ray-curable component (b) is produced in this HSP space, the HSP of the energy-ray-curable component (a0) is included in the region of the Hansen dissolving sphere of the non-energy-ray-curable component (b). |
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