TWI809295B

This invention provides a conductive composition capable of forming a hardened product with good solder wettability. The conductive composition provided by this invention includes an adhesive component including a thermosetting compound, metal particles and a fluorosurfactant; the metal particles in...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	YAMAGUCHI, NORIHIRO, YAMAMOTO, MASAHIRO, FUJIKAWA, RYOTA
Format:	Patent
Sprache:	chi
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CONDUCTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	This invention provides a conductive composition capable of forming a hardened product with good solder wettability. The conductive composition provided by this invention includes an adhesive component including a thermosetting compound, metal particles and a fluorosurfactant; the metal particles include metal particles having a low melting point which is lower than 240 DEG C and metal particles having a high melting point which is higher than 800 DEG C; and compared with the adhesive component in the mass part of 100, the metal particles are in the mass part of 1000 to 2000, and the metal particles having the low melting point are in the mass part of 10 to 900.